- Etch Process
BCnC Combo Ring is a key part in the Etching chamber to uniformly distribute the plasma
onto the wafer.
- Etch Process
BCnC Single Ring is a key part in the Etching process to uniformly distribute the plasma
onto the wafer.
- Etch Process
BCnC Focus Ring is a key part in the Etching process to uniformly distribute the plasma
onto the wafer.
- Etch Process
BCnC Top Ring is a key part in the Etching process to uniformly distribute the plasma
onto the wafer.
- CVD Process
Apply electrodes from outside the Dome to create plasma in the Vacuum Chamber to uniformly distribute the plasma in the CVD process.
- Etch Process
Apply electrodes from outside the UEL Plate to create plasma in the Vacuum Chamber to distribute the plasma to provide stable process control.
- CVD Process
Apply electrodes from outside the Tube to create plasma in the Vacuum Chamber to distribute the plasma to provide stable process control.
- CVD Process
Inside Vacuum Chamber, Liner is used to protect the best plasma environment condition.